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PZUxBL series
Single Zener diodes
Rev. 01 -- 6 May 2008 Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I Non-repetitive peak reverse power dissipation: PZSM 40 W I Total power dissipation: Ptot 250 mW I Tolerance series: B: approximately 5 %; B2: approximately 2 % I Wide working voltage range: nominal 2.4 V to 36 V (E24 range) I Low reverse current IR range I Small plastic package suitable for surface-mounted design I AEC-Q101 qualified
1.3 Applications
I General regulation functions
1.4 Quick reference data
Table 1. Symbol VF PZSM Ptot
[1] [2] [3] [4]
Quick reference data Parameter forward voltage non-repetitive peak reverse power dissipation total power dissipation Tamb 25 C Conditions IF = 100 mA
[1] [2]
Min -
Typ -
Max 1.1 40 250
Unit V W mW
[3][4]
Pulse test: tp 300 s; 0.02. tp = 100 s; square wave; Tj = 25 C prior to surge Reflow soldering is the only recommended soldering method. Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
NXP Semiconductors
PZUxBL series
Single Zener diodes
2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
Graphic symbol
1
2
1
2
006aaa152
Transparent top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3. Ordering information Package Name PZU2.4BL to PZU36BL[1] PZU2.7B2L to PZU24B2L[2]
[1] [2] The series consists of 29 types with nominal working voltages from 2.4 V to 36 V. The series consists of 25 types with nominal working voltages from 2.7 V to 24 V.
Type number
Description leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm
Version SOD882
-
4. Marking
Table 4. PZU2.4BL PZU2.7BL PZU3.0BL PZU3.3BL PZU3.6BL PZU3.9BL PZU4.3BL PZU4.7BL PZU5.1BL PZU5.6BL PZU6.2BL PZU6.8BL PZU7.5BL PZU8.2BL PZU9.1BL PZU10BL PZU11BL
PZUXBL_SER_1
Marking codes Marking code H2 H3 H4 H5 H6 H7 H8 H9 HA HB HC HD HE HF HG HH HK
Rev. 01 -- 6 May 2008
Type number
Type number PZU2.7B2L PZU3.0B2L PZU3.3B2L PZU3.6B2L PZU3.9B2L PZU4.3B2L PZU4.7B2L PZU5.1B2L PZU5.6B2L PZU6.2B2L PZU6.8B2L PZU7.5B2L PZU8.2B2L PZU9.1B2L PZU10B2L PZU11B2L PZU12B2L
Marking code HZ K1 K2 K3 K4 K5 K6 K7 K8 H1 K9 KA KB KC KD KE KF
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
2 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
Marking codes ...continued Marking code HL HM HN HP HR HS HT HU HV HW HX HY Type number PZU13B2L PZU14B2L PZU15B2L PZU16B2L PZU18B2L PZU20B2L PZU22B2L PZU24B2L Marking code KG KH KK KL KM KN KP KR -
Table 4. PZU12BL PZU13BL PZU15BL PZU16BL PZU18BL PZU20BL PZU22BL PZU24BL PZU27BL PZU30BL PZU33BL PZU36BL
Type number
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol IF IZSM Parameter forward current non-repetitive peak reverse current non-repetitive peak reverse power dissipation total power dissipation junction temperature ambient temperature storage temperature
tp = 100 s; square wave; Tj = 25 C prior to surge Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[1]
Conditions
Min -
Max 200 see Table 8 and 9 40 250 500 150 +150 +150
Unit mA
PZSM Ptot Tj Tamb Tstg
[1] [2] [3] [4]
[1]
-55 -65
W mW mW C C C
Tamb 25 C
[2][3] [2][4]
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
3 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Rth(j-sp)
[1] [2] [3] [4]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air
[1][2] [1][3] [4]
Min -
Typ -
Max 500 250 55
Unit K/W K/W K/W
Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab.
7. Characteristics
Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 10 mA IF = 100 mA
[1] Pulse test: tp 300 s; 0.02.
Conditions
[1]
Min -
Typ -
Max 0.9 1.1
Unit V V
Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L Tj = 25 C unless otherwise specified. PZUxxx Sel Working voltage VZ (V) IZ = 5 mA Min 2.4 2.7 3.0 3.3 3.6 3.9 4.3 B B B2 B B2 B B2 B B2 B B2 B B2
PZUXBL_SER_1
Differential resistance Reverse current r ()
dif
Temperature coefficient SZ (mV/K) IZ = 5 mA
IR (A) IZ = 0.5 mA IZ = 5 mA Max 1000 1000 1000 1000 1000 1000 1000 Max 100 100 95 95 90 90 90 Max 50 20 10 5 5 3 3 VR (V) 1 1 1 1 1 1 1
Diode Non-repetitive capacitance peak reverse current C (pF)[1]
d
IZSM (A)[2] Max 2.6 2.9 2.9 3.20 3.20 3.50 3.50 3.80 3.80 4.10 4.10 4.48 4.34
(c) NXP B.V. 2008. All rights reserved.
Typ -1.6 -2.0 -2.1 -2.4 -2.4 -2.5 -2.5
Max 450 440 425 410 390 370 350
Max 8 8 8 8 8 8 8
2.3 2.5 2.65 2.80 2.95 3.10 3.25 3.40 3.55 3.70 3.87 4.01 4.15
Product data sheet
Rev. 01 -- 6 May 2008
4 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L ...continued Tj = 25 C unless otherwise specified. PZUxxx Sel Working voltage VZ (V) IZ = 5 mA Min 4.7 5.1 5.6 B B2 B B2 B B2
[1] [2]
Differential resistance Reverse current r ()
dif
Temperature coefficient SZ (mV/K) IZ = 5 mA
IR (A) IZ = 0.5 mA IZ = 5 mA Max 800 250 100 Max 80 60 40 Max 2 2 1 VR (V) 1 1.5 2.5
Diode Non-repetitive capacitance peak reverse current C (pF)[1]
d
IZSM (A)[2] Max 4.90 4.75 5.37 5.20 5.92 5.73 1.9 275 5.5 0.3 300 5.5 Typ -1.4 Max 325 Max 8
4.42 4.55 4.84 4.98 5.31 5.49
f = 1 MHz; VR = 0 V tp = 100 s; square wave; Tj = 25 C prior to surge
Table 9. Characteristics per type; PZU6.2BL to PZU36BL Tj = 25 C unless otherwise specified. PZUxxx Sel Working voltage VZ (V) IZ = 5 mA Min 6.2 6.8 7.5 8.2 9.1 10 11 12 13 14
PZUXBL_SER_1
Differential resistance Reverse current r ()
dif
Temperature coefficient SZ (mV/K) IZ = 5 mA
IR (nA) IZ = 0.5 mA IZ = 5 mA Max 80 60 60 60 60 Max 30 20 10 10 10 10 10 10 10 10 Max 500 500 500 500 500 100 100 100 100 100 VR (V) 3 3.5 4 5 6 7 8 9 10 11
Diode Non-repetitive capacitance peak reverse current C (pF)[1]
d
IZSM (A)[2] Max 6.53 6.33 7.14 6.93 7.84 7.60 8.64 8.36 9.55 9.23 10.55 60 10.21 7.4 8.4 9.4 10.4 108 105 103 101 3 3 2.5 2
(c) NXP B.V. 2008. All rights reserved.
Typ 2.7 3.4 4.0 4.6 5.5 6.4
Max 250 215 170 150 120 110
Max 5.5 5.5 3.5 3.5 3.5 3.5
B B2 B B2 B B2 B B2 B B2 B B2 B B2 B B2 B B2 B2
5.86 6.06 6.47 6.65 7.06 7.28 7.76 8.02 8.56 8.85 9.45 9.77
10.44 11.56 60 10.76 11.22 11.42 12.60 80 11.74 12.24 12.47 13.96 80 12.91 13.49 13.70 14.30 80
Product data sheet
Rev. 01 -- 6 May 2008
5 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
Table 9. Characteristics per type; PZU6.2BL to PZU36BL ...continued Tj = 25 C unless otherwise specified. PZUxxx Sel Working voltage VZ (V) IZ = 5 mA Min 15 16 18 20 22 24 27 30 33 36
[1] [2]
Differential resistance Reverse current r ()
dif
Temperature coefficient SZ (mV/K) IZ = 5 mA
IR (nA) IZ = 0.5 mA IZ = 5 mA Max Max 15 20 20 20 25 30 40 40 40 60 Max 50 50 50 50 50 50 50 50 50 50 VR (V) 11 12 13 15 17 19 21 23 25 27
Diode Non-repetitive capacitance peak reverse current C (pF)[1]
d
IZSM (A)[2] Max Typ 11.4 12.4 14.4 16.4 18.4 20.4 23.4 26.6 29.7 33.0 Max 99 97 93 88 84 80 73 66 60 59 Max 2 1.5 1.5 1.5 1.3 1.3 1 1 0.9 0.8
B B2 B B2 B B2 B B2 B B2 B B2 B B B B
13.84 15.52 80 14.34 14.98 15.37 17.09 80 15.85 16.51 16.94 19.03 80 17.56 18.35 18.86 21.08 100 19.52 20.39 20.88 23.17 100 21.54 22.47 22.93 25.57 120 23.72 24.78 25.1 28 31 34 28.9 32 35 38 150 200 250 300
f = 1 MHz; VR = 0 V tp = 100 s; square wave; Tj = 25 C prior to surge
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
6 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
103 PZSM (W) 102
006aab129
300 IF (mA) 200
mbg781
10
100
1 10-1
1 tp (ms)
10
0 0.6
0.8 VF (V)
1
Tj = 25 C (prior to surge)
Tj = 25 C
Fig 1.
Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values
mgl273
Fig 2.
Forward current as a function of forward voltage; typical values
0 SZ (mV/K) -1
10 12 SZ (mV/K) 5 11 10 9.1 8.2 7.5 6.8
mgl274
4.3
3.9 3.6
6.2 5.6 5.1 4.7
-2
3.3 3.0 2.4 2.7
0
-3
-5 0 20 40 IZ (mA) 60
0
4
8
12
16
IZ (mA)
20
Tj = 25 C to 150 C PZU2.4BL to PZU4.3B2L
Tj = 25 C to 150 C PZU4.7BL to PZU12B2L
Fig 3.
Temperature coefficient as a function of working current; typical values
Fig 4.
Temperature coefficient as a function of working current; typical values
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
7 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
102 IZ (mA) 10 VZ(nom) (V) = 2.4 3.0 2.7 3.3
006aab246
102 IZ (mA) VZ(nom) (V) = 4.7
006aab247
3.6 3.9
4.3
10 5.6 6.8 6.2 8.2 7.5 9.1 10 11 12
1
1
5.1
10-1
10-1
10-2
10-2
10-3 0 1 2 3 4 VZ (V) 5
10-3 0 2 4 6 8 10 12 14 VZ (V)
Tj = 25 C PZU2.4BL to PZU4.3B2L
Tj = 25 C PZU4.7BL to PZU12B2L
Fig 5.
Working current as a function of working voltage; typical values
102 IZ (mA) 10 14 15 16 18 20 22 24 VZ(nom) (V) = 13
Fig 6.
Working current as a function of working voltage; typical values
006aab248
27 30
33 36
1
10-1
10-2
10-3 10 20 30 VZ (V) 40
Tj = 25 C PZU13BL to PZU36BL
Fig 7.
Working current as a function of working voltage; typical values
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
8 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
9. Package outline
0.62 0.55 2
0.50 0.46
0.30 0.22
0.65 0.30 0.22 0.55 0.47 Dimensions in mm
1.02 0.95
1
cathode marking on top side 03-04-17
Fig 8.
Package outline SOD882
10. Packing information
Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PZU2.4BL to PZU36BL PZU2.7B2L to PZU24B2L
[1] For further information and the availability of packing methods, see Section 13.
Package SOD882
Description 2 mm pitch, 8 mm tape and reel
Packing quantity 10000 -315
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
9 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
11. Soldering
1.30 R = 0.05 (8x) 0.30 R = 0.05 (8x)
0.90
0.60 0.70 0.80 (2x) (2x) (2x)
solder lands solder paste solder resist occupied area
0.30 (2x) 0.40 (2x) 0.50 (2x)
mbl872
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 9.
Reflow soldering footprint SOD882
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
10 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
12. Revision history
Table 11. Revision history Release date 20080506 Data sheet status Product data sheet Change notice Supersedes Document ID PZUXBL_SER_1
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
11 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PZUXBL_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 6 May 2008
12 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information. . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 May 2008 Document identifier: PZUXBL_SER_1

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